Elactrostatically Discharged PS Film for Thermoformed Electronics Packaging

An electrostatically discharged PS film for thermoformed electronics packaging is newly available from Polykemie’s Scanfill AB (U.S. office in Dallas, N.C.) The company successfully completed its first customer trials in late 2021, and Scanfoil PS ESD has been shown to be an excellent packaging material for the electronics industry, as it protects advanced technical applications against static discharge thanks to its surface resistivity.

According to technical support specialist Karl Banke, the company has taken a next step in its work with customized packaging materials, as they can adjust conductivity of PS ESD in accordance with the customer’s requirements. Scanfill offers materials with surface resistivity ranging from 10^2 to 10^9 Ω. Within this range, they can specify smaller ranges and offer material with an accurately specified surface resistivity, for example 10^2–10^4, 10^3–10^6, and 10^5–10^9 Ω.

In autumn 2022, Scanfill will further expand its material portfolio by launching Scanfoil PP ESD (Polypropylene Electrostatic Discharge). Noting that PP has an even smaller impact on the environment than PS, Banke says,  and is highly sought-after in the recycling market.“It is perfectly aligned with Scanfill’s green profile and its portfolio of eco-friendly and sustainable foils for thermoforming.”

Scanfill says it can provide such films/foils with as high as 75% recycled content and 52% minerals, to lower the environmental impact and at the same time deliver a very high-quality product. Skanofoils are offered in different colors on both the outside and inside of the packaging, and their surfaces can be given a matte finish to enhance the soft feeling and at the same time be printable.