Materials
LSR Molders Now Can Tailor Cure Speed, Temperature & Durometer
Elkem’s LSR Select is enabling faster cures at lower temperatures and custom durometer blends. Dosing equipment has caught up with capabilities of this novel material system.
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Henkel Offers Materials Platform for Additive Manufacturing
The company’s open materials platform is designed to collaborate with manufacturers of 3D printers and system providers to enable the qualification of new materials for different printing technologies.
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DowDuPont to Complete Spin-Off of Companies
Following last month’s spin-off of a ‘new’ Dow, the spin-off of an independent DuPont materials company and the new Corteva agriculture firm will take place June 1.
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First CFRTP for High-Volume Production Vehicles Now in Use
Teijin’s Sereebo carbon fiber reinforced thermoplastic selected by GM for use in select pickup box applications.
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Materials: Color-Changing Continuous Acrylic Sheet for Illuminated Signage
Plaskolite’s new Optix-L Black/White acrylic sheet reduces materials needed for many back-lit signs and graphic installations.
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INEOS Styrolution to Build Production Site for Thermoplastic Composite Stylight
Demand for automotive, electronics and sports industries drives INEOS Styrolution to invest in a dedicated production site for its Stylight composite product line.
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PPA Inducts Eight New Members
Plastics Pioneers Association adds to membership roster following April meeting.
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SABIC & Partners Collaborate to Produce 'Revolutionary' Thermoplastic Composite Vehicle Panel
Cost-effective and lightweight vehicle panels produced using SABIC’s Udmax tape in a one-shot compression molding process challenges panels made of metal or thermosets.
Read MoreArkema and 3DXTech Bring FluorX Material To Ultimaker’s Cura Marketplace
The new PVDF-based filament is specifically designed for printing highly technical 3D parts that require extreme performance.
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Victrex to Make Multi-Million Euro Investment in Bond 3D Technology
Victrex and Bond will initially focus their new collaboration on demonstrating the potential in the spine and the semiconductor segments.
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